Light-induced degradation of copper-contaminated Si was first observed in early experiments performed by Henley et al. [1] and Tarasov et al. [2] in 1998, who observed a degradation of minority carrier diffusion length in 9-20 Ωcm p-type Cz-Si (see Figure 1 for an example of copper LID). Similar observations in B-doped FZ-Si, n-type Si and Ga-doped Si confirmed the occurrence of such degradation regardless of boron or oxygen concentration [3-5]. The existence of LID in intentionally Cu-contaminated Ga-doped Si (i.e. – absent of any BO-LID effects) confirmed the role of Cu in this degradation, leading to the definition of this mechanism as Cu-related light-induced degradation (Cu-LID).
Cu-LID has been shown to rely on the presence of interstitial Cu (Cui) in the bulk prior to illumination [6]. The degradation rate of Cu-LID has since been observed to increase with increasing temperature [7], illumination intensity [8], interstitial Cu concentration [9] and oxygen/BMD concentration [10]. Conversely, the degradation rate decreases with increasing doping concentration [7]. Unlike BO-LID, only partial recovery of Cu-LID has been observed in Cz-Si and FZ-Si after annealing at 200 °C, and only if the concentration of Cui is below 1014 cm-3 [11], whilst no recovery has been observed in Si with higher Cui concentrations. However, high-temperature rapid-thermal-annealing (800-900 °C) has resulted in full defect dissociation [12].
Recent analysis of Cu-LID defects in Si by Inglese et al. using lifetime spectroscopy indicated that the most likely source of Cu-LID is a silicide-based precipitate of Cu [13]. The Cu-LID defect recombination parameters identified by Inglese et al. also correspond with the recombination parameters determined for thermally-generated Cu precipitates as identified by Macdonald et al. [14], thus strengthening the hypothesis of Cu precipitates as the defect responsible for Cu-LID in Si.
Figure 1: Effective minority lifetime of a copper-contaminated c-Si sample as a function of illumination time.